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Available Lead-Free Solder Alloys
Indium Corporation offers custom alloy development for specific
temperature requirements and for special metallizations as well as
non-metal bonding applications. Indium Corporation has been developing
lead-free and cadmium-free alloys for many years. We have over 25
standard alloys, including our three patented alloys (see notes below).
Or we can develop an alloy for your specific application.
If you would like to evaluate several of these alloys,
consider our
Wire Selector
Kit, which offers many choices without cadmium or lead. |
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Low Temperature Solders |
| Indalloy No. |
Composition |
Solidus
(oC.) |
Liquidus
(oC.) |
U.S. Patent |
Comments |
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51In / 32.5Bi / 16.5Sn |
60 |
(eutectic) |
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Lowest melting point alloy; uncommon applications. |
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66.3In / 33Bi |
72 |
(eutectic) |
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Poor wetting. |
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57Bi / 26In / 17Sn |
79 |
(eutectic) |
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Marginal wetting. |
27 |
54.02Bi / 29.68In / 16.3Sn |
81 |
(eutectic) |
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Marginal wetting. |
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52In / 48Sn |
118 |
(eutectic) |
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Lowest melting point solder with good wetting. |
281 |
58Bi / 42Sn |
138 |
(eutectic) |
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Good thermal fatigue performance; established history. |
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Mid-Range Temperature Solders |
| Indalloy No. |
Composition |
Solidus (oC.) |
Liquidus (oC.) |
U.S. Patent |
Comments |
| 231 |
86.5Sn / 5.5Zn / 4.5In / 3.5Bi |
174 |
186 |
5,455,0043 |
Zn causes high drossing; corrosion concerns; not available
as paste. |
| 226 |
83.6Sn / 8.8In / 7.6Zn |
181 |
187 |
5,242,6583 |
Zn causes high drossing; corrosion concerns; not available
as paste. |
| 227 |
77.2Sn / 20.0In / 2.8Ag |
175 |
187 |
5,256,3703 & 5,580,5203 |
Not for use over 100oC due to 118oC Sn
/ In eutectic; cost. |
| 254 |
86.9Sn / 10.0In / 3.1Ag |
204 |
205 |
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Lower indium mitigates Sn / In eutectic problem. |
| 201 |
91Sn / 9Zn |
199 |
(eutectic) |
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Zn causes high drossing, not available as paste. |
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Higher Temperature Solders |
| Indalloy No. |
Composition |
Solidus (oC.) |
Liquidus (oC.) |
U.S. Patent |
Comments |
| 2411 |
95.5Sn / 3.8Ag / 0.7Cu |
217 |
220 |
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Popular SAC alloy for SMT assembly. |
| 246 |
95.5Sn / 4.0Ag / 0.5Cu |
217 |
225 |
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Petzow (German) prior art reference makes this alloy patent-free. |
| 2521 |
95.5Sn / 3.9Ag / 0.6Cu |
217 |
225 |
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NEMI promoted alloy |
| 2561 |
96.5Sn / 3.0Ag / 0.5Cu |
217 |
220 |
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Reduced silver SAC alloy. |
| 232 |
93.6Sn / 4.7Ag / 1.7Cu |
217 |
244 |
5,527,6284 |
Original Iowa State Ames Lab SAC alloy. |
| 249 |
91.8Sn / 3.4Ag / 4.8Bi |
211 |
213 |
5,439,6394 |
Board & component metallizations
must be completely Pb-free. |
| 121 |
96.5Sn / 3.5Ag |
221 |
(eutectic) |
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Simple binary alloy solder has history of use; marginal wetting. |
| 2442 |
99.3Sn / 0.7Cu |
227 |
(eutectic) |
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Inexpensive, popular use in wave soldering. |
| 129 |
99Sn / 1Sb |
232 |
235 |
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Antimony addition increase strength. |
| 131 |
97Sn / 3Sb |
232 |
238 |
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Antimony addition increase strength. |
| 133 |
95Sn / 5Sb |
235 |
240 |
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Antimony addition increase strength. |
| 209 |
65Sn / 25Ag / 10Sb |
233 |
(melting point) |
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Motorola-developed “J-alloy” die
attach solder; very brittle. |
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High Temperature Solders |
| Indalloy No. |
Composition |
Solidus
(oC.) |
Liquidus
(oC.) |
U.S. Patent |
Comments |
| 182 |
80Au /
20Sn |
280 |
(eutectic) |
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Highest temperature Pb-free. |
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- 1Alloys of choice for general SMT assembly
- 2Alloy of choice for general wave solder assembly
- 3ICA Patented Alloy
- 4ICA Licensed Patent
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